Itekhnoloji yotywino lweChip yitekhnoloji yokwakha ebhityileyo esetyenziselwa ukuseka imisebenzi yomphezulu wendlela. Indlela esisiseko kukuqala ukusasaza isixa esifanelekileyo se-asphalt binder ngokulinganayo kumphezulu wendlela ngokusebenzisa izixhobo ezikhethekileyo, kwaye emva koko usasaze ubungakanani obufanayo bamasuntswana amatye atyumkileyo axineneyo kumaleko we-asphalt, kwaye emva kokuqengqeleka, umyinge omalunga ne-3/ / 5 yeengqungquthela zamatye ezichotshoziweyo zifakwe kwi-asphalt layer.
Itekhnoloji ye-Chip seal inomsebenzi obalaseleyo wokuchasana nokutyibilika kunye nesiphumo esisebenzayo sokutywinwa kwamanzi, ixabiso eliphantsi, inkqubo yokwakha elula, isantya sokwakha ngokukhawuleza, njl., ngoko obu bugcisa busetyenziswa kakhulu eYurophu nase-United States.

Itekhnoloji ye-Chip seal ifanelekile:
1. Ukwaleka kolungiso lwendlela
2. Indlela entsha yokunxiba
3. Umphezulu wendlela entsha ephakathi kunye nekhaphukhaphu
4. Umaleko wokudityaniswa koxinzelelo
Iinzuzo zobugcisa ze-chip seal:
1. Isiphumo esihle sokutywinwa kwamanzi
2. Amandla okuguqula amandla
3. Ukusebenza kakuhle kwe-anti-skid
4. Iindleko eziphantsi
5. Isantya sokwakha ngokukhawuleza
Iintlobo zezibophelelo ezisetyenziselwa ukutywinwa kwetshiphu:
1. I-asphalt ehlanjululweyo
2. I-asphalt e-emulsified/modified emulsified asphalt
3. I-asphalt elungisiweyo
4. I-asphalt yomgubo werabha